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DMP3028LSD-13 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS

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DMP3028LSD-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - DMP3028LSD-13
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DMP3028LSD-13 Details

  • Manufacturer Part Number:

    DMP3028LSD-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    6 A

  • Drain-source On Resistance-Max:

    0.025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    110 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.7 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMP3028LSD-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMP3028LSD-13 is a standard SOT23 package with a 1.5mm x 1.5mm pad size, with a 0.5mm keep-out zone around the package.
  • To ensure proper biasing, connect the gate to a voltage source through a 1kΩ to 10kΩ resistor, and connect the source to ground through a 100Ω to 1kΩ resistor. The drain should be connected to the load or a voltage source.
  • The maximum SOA for the DMP3028LSD-13 is defined by the boundaries of the drain-source voltage (Vds) and drain current (Id). Refer to the datasheet's SOA graph for specific limits.
  • Yes, the DMP3028LSD-13 is suitable for high-frequency switching applications up to 100 kHz. However, ensure proper PCB layout, decoupling, and thermal management to minimize losses and ensure reliability.
  • Ensure good thermal conductivity by using a thermal pad or heat sink, and maintain a maximum junction temperature (Tj) of 150°C. Use thermal interface materials and follow recommended PCB layout guidelines to minimize thermal resistance.

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DMP3028LSD-13 Overview

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