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DMP6018LPSQ-13 - Diodes Incorporated

Description: 60V P-CHANNEL ENHANCEMENT MODE MOSFET, PowerDI5060-8

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DMP6018LPSQ-13 - Diodes Incorporated PCB footprint - Other - Other - PowerDI5060-8_H1.1
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DMP6018LPSQ-13 - Diodes Incorporated  - 3D model - Other - PowerDI5060-8_H1.1
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DMP6018LPSQ-13 Details

  • Manufacturer Part Number:

    DMP6018LPSQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    331 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.018 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    200 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    113 W

  • Pulsed Drain Current-Max (IDM):

    240 A

  • Reference Standard:

    AEC-Q101; IATF 16949; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMP6018LPSQ-13 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are recommended for optimal thermal performance.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to achieve this.
  • Handle the device in an ESD-controlled environment, use ESD-protective packaging, and ground yourself before handling the device to prevent ESD damage.
  • The device is rated for operation up to 125°C. However, the maximum junction temperature should not exceed 150°C. Ensure proper thermal management and derate the device accordingly for high-temperature operation.
  • Use a systematic approach to troubleshoot issues, starting with checking the power supply, input signals, and output loads. Use oscilloscopes and logic analyzers to debug the device's behavior.

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DMP6018LPSQ-13 Overview

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