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DMP6023LEQ-13 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS: 41V-60V 60V P-CHANNEL ENHANCEMENT MODE MOSFET

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PCB Footprints
DMP6023LEQ-13 - Diodes Incorporated PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT223
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DMP6023LEQ-13 - Diodes Incorporated  - 3D model - SOT223 (3-Pin) - SOT223
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DMP6023LEQ-13 Details

  • Manufacturer Part Number:

    DMP6023LEQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-223, 4 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    62.9 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    0.028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    143 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    17.3 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMP6023LEQ-13 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal relief pattern are recommended to ensure good heat dissipation.
  • The device requires a bias voltage of 2.5V to 5.5V on the VCC pin, and the input voltage on the VIN pin should be within the recommended operating range. Ensure the input and output capacitors are properly selected and placed close to the device.
  • The maximum current rating for the output pins is 1A. However, it's recommended to derate the current based on the ambient temperature and PCB thermal design to ensure reliable operation.
  • Use a voltage regulator or a voltage supervisor to ensure the input voltage remains within the recommended operating range. Additionally, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage from voltage transients.
  • The device has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.

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DMP6023LEQ-13 Overview

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