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DMPH6050SSD-13 - Diodes Incorporated

Description: Dual MOSFET, P Channel, 60 V, 60 V, 5.2 A, 5.2 A, 0.034 ohm

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DMPH6050SSD-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMPH6050SSD-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8(Thickness=1.7mm)
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3D Models
DMPH6050SSD-13 - Diodes Incorporated - 3D model - Small Outline Packages - SO-8(Thickness=1.7mm)
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DMPH6050SSD-13 Details

  • Manufacturer Part Number:

    DMPH6050SSD-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    33 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    5.2 A

  • Drain-source On Resistance-Max:

    0.048 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    70 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    35 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMPH6050SSD-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMPH6050SSD-13 is a standard SOT23 package with a 1.3mm x 1.3mm body size and a 0.5mm pitch. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure reliable operation of the DMPH6050SSD-13 in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking and airflow, and ensuring that the device is operated within its specified temperature range (-40°C to 150°C).
  • The maximum allowable voltage for the DMPH6050SSD-13 is 20V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Yes, the DMPH6050SSD-13 can be used in switching applications, but it is recommended to follow proper switching guidelines and ensure that the device is operated within its specified switching frequency and voltage ranges.
  • To handle ESD protection for the DMPH6050SSD-13, it is recommended to follow proper ESD handling and storage procedures, such as using ESD-safe materials and equipment, and ensuring that the device is properly grounded during handling and assembly.

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DMPH6050SSD-13 Overview

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