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DMPH6050SSDQ-13 - Diodes Incorporated

Description: Mosfet Array 60V 5.2A (Ta) 2W (Ta) Surface Mount 8-SOIC

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DMPH6050SSDQ-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8_2023
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DMPH6050SSDQ-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8_2023
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DMPH6050SSDQ-13 Details

  • Manufacturer Part Number:

    DMPH6050SSDQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    33 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    5.2 A

  • Drain-source On Resistance-Max:

    0.048 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    70 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    35 A

  • Reference Standard:

    AEC-Q101; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMPH6050SSDQ-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMPH6050SSDQ-13 is a standard SOT23 package with a 1.5mm x 1.5mm pad size, and a 0.5mm spacing between pads.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum operating temperature range for the DMPH6050SSDQ-13 is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • Yes, the DMPH6050SSDQ-13 is suitable for high-reliability and automotive applications, as it meets the AEC-Q101 qualification standard for automotive-grade components.
  • To prevent ESD damage, handle the DMPH6050SSDQ-13 with an anti-static wrist strap or mat, and ensure the PCB and components are properly grounded during assembly and testing.

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DMPH6050SSDQ-13 Overview

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