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DMT15H017LPS-13 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS: 101V-250V PowerDI5060-8 T&R 2.5K

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DMT15H017LPS-13 - Diodes Incorporated - PCB symbol
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DMT15H017LPS-13 - Diodes Incorporated PCB footprint - Other - Other - PowerDI5060-8_2026
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DMT15H017LPS-13 - Diodes Incorporated - 3D model - Other - PowerDI5060-8_2026
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DMT15H017LPS-13 Details

  • Manufacturer Part Number:

    DMT15H017LPS-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2019-11-01

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    315.4 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    58 A

  • Drain-source On Resistance-Max:

    0.0255 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    89 W

  • Pulsed Drain Current-Max (IDM):

    230 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMT15H017LPS-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMT15H017LPS-13 is a standard SOT23-6L package with a 1.8mm x 1.35mm body size. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure proper soldering, follow the recommended soldering temperature profile and use a solder with a melting point below 260°C. Apply a small amount of solder paste to the PCB pads and use a reflow oven or a hot air gun to solder the device.
  • The DMT15H017LPS-13 is rated for operation from -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, so it's essential to consider the application's temperature range when designing with this device.
  • Yes, the DMT15H017LPS-13 is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions and design guidelines to ensure the device meets the application's requirements.
  • The DMT15H017LPS-13 has an ESD rating of 2kV human body model (HBM) and 150V machine model (MM). To prevent ESD damage, handle the device with an anti-static wrist strap, mat, or other ESD protection equipment.

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DMT15H017LPS-13 Overview

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