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DMT3020LSDQ-13 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS: 8V 24V SO-8 T&R 2.5K

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DMT3020LSDQ-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - DMT3020LSDQ-13
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DMT3020LSDQ-13 - Diodes Incorporated  - 3D model - Small Outline Packages - DMT3020LSDQ-13
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DMT3020LSDQ-13 Details

  • Manufacturer Part Number:

    DMT3020LSDQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    8.5 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    16 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    27 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Reference Standard:

    AEC-Q101; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMT3020LSDQ-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DMT3020LSDQ-13 should include a solid ground plane, wide traces for power and ground, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation across the full temperature range, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink or PCB.
  • The DMT3020LSDQ-13 has built-in ESD protection, but it's still important to follow standard ESD handling precautions, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Avoid touching the device pins or handling the device in a way that could generate static electricity.
  • The DMT3020LSDQ-13 is a commercial-grade device, but Diodes Incorporated offers other versions with enhanced reliability and automotive-grade options. For high-reliability or automotive applications, consider using a device specifically designed and qualified for those markets, such as the AEC-Q100 qualified version.
  • Follow the recommended soldering and rework conditions outlined in the datasheet, including peak temperatures, soldering times, and rework techniques. It's also essential to use a soldering iron with a temperature-controlled tip and a solder with a melting point compatible with the device's package.

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DMT3020LSDQ-13 Overview

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