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DMT6012LSS-13 - Diodes Incorporated

Description: 60V N-CHANNEL ENHANCEMENT MODE MOSFET, SO-8

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DMT6012LSS-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMT6012LSS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8_2024
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3D Models
DMT6012LSS-13 - Diodes Incorporated - 3D model - Small Outline Packages - SO-8_2024
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DMT6012LSS-13 Details

  • Manufacturer Part Number:

    DMT6012LSS-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    37.5 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    10.4 A

  • Drain-source On Resistance-Max:

    0.011 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    27.5 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.84 W

  • Pulsed Drain Current-Max (IDM):

    65 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMT6012LSS-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMT6012LSS-13 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V to 5.5V, and the enable pin (EN) to a logic-level signal (0V or VIN). The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to ensure stability.
  • The DMT6012LSS-13 is capable of delivering up to 150mA of output current. However, it's recommended to limit the output current to 100mA for optimal performance and to prevent overheating.
  • To protect the DMT6012LSS-13, add a 5.5V zener diode in parallel with the input capacitor to prevent overvoltage. Additionally, consider adding a 100mA polyfuse or a current-limiting resistor in series with the output to prevent overcurrent conditions.
  • The DMT6012LSS-13 is rated for operation from -40°C to 85°C. However, it's recommended to operate the device within a temperature range of 0°C to 70°C for optimal performance and reliability.

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DMT6012LSS-13 Overview

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