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DMTH6016LFVWQ-13 - Diodes Incorporated

Description: 60V 175°C N-Channel Enhancement Mode MOSFET

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DMTH6016LFVWQ-13 - Diodes Incorporated PCB footprint - Other - Other - PowerDI3333-8 (SWP) (Type UX)_2022
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DMTH6016LFVWQ-13 - Diodes Incorporated  - 3D model - Other - PowerDI3333-8 (SWP) (Type UX)_2022
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DMTH6016LFVWQ-13 Details

  • Manufacturer Part Number:

    DMTH6016LFVWQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    12.8 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    41 A

  • Drain-source On Resistance-Max:

    0.016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    23.4 pF

  • JESD-30 Code:

    S-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.38 W

  • Pulsed Drain Current-Max (IDM):

    160 A

  • Reference Standard:

    AEC-Q101; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMTH6016LFVWQ-13 Frequently Asked Questions (FAQs)

  • Diodes Incorporated recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the PCB.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s, and avoid exceeding 3 reflows. Use a solder with a melting point above 217°C.
  • The DMTH6016LFVWQ-13 is rated for operation from -55°C to 150°C, but the maximum junction temperature (TJ) should not exceed 150°C.
  • Yes, the DMTH6016LFVWQ-13 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and design guidelines.
  • Follow standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation. Ensure the device is stored in an anti-static bag or tube when not in use.

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DMTH6016LFVWQ-13 Overview

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