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DN2625DK6-G - Microchip

Description: Microchip DN2625DK6-G N-channel MOSFET Transistor, 1.1 A, 250 V Depletion, 8-Pin DFN

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DN2625DK6-G - Microchip PCB footprint - Other - Other - DN2625DK6-G-3
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DN2625DK6-G - Microchip  - 3D model - Other - DN2625DK6-G-3
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DN2625DK6-G Details

  • Manufacturer Part Number:

    DN2625DK6-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    VDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    LOW THRESHOLD

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    1.1 A

  • Drain-source On Resistance-Max:

    3.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    70 pF

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    3.3 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    30 ns

  • Turn-on Time-Max (ton):

    30 ns

DN2625DK6-G Frequently Asked Questions (FAQs)

  • A good PCB layout for the DN2625DK6-G involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces connected to the high-frequency pins. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power and decoupling, use a high-quality power supply with low ripple and noise. Add decoupling capacitors (e.g., 10uF and 100nF) close to the device's power pins, and use a 10kΩ resistor in series with the capacitor to prevent oscillations.
  • The recommended clock source for the DN2625DK6-G is a high-quality crystal oscillator or a low-jitter clock source. A clock frequency of 25MHz or 26MHz is recommended for optimal performance.
  • To minimize EMI, use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke on the power lines. Also, ensure that the device's clock frequency is not harmonically related to the system's switching frequency.
  • To manage thermal issues, use a heat sink with a thermal conductivity of at least 1W/m-K, and apply a thermal interface material (TIM) with a thermal conductivity of at least 5W/m-K. Ensure good airflow around the device and avoid blocking the airflow.

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DN2625DK6-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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