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DN2625K4-G - Microchip

Description: MOSFET 250V 3.3A

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DN2625K4-G - Microchip PCB footprint - Other - Other - DN2625K4-G-1
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DN2625K4-G - Microchip  - 3D model - Other - DN2625K4-G-1
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DN2625K4-G Details

  • Manufacturer Part Number:

    DN2625K4-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    DPAK-3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    LOW THRESHOLD

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    1.1 A

  • Drain-source On Resistance-Max:

    3.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    70 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    3.3 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    30 ns

  • Turn-on Time-Max (ton):

    30 ns

DN2625K4-G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a reliable power supply, and ensure that the device is operated within its specified voltage and current ratings.
  • For EMI and EMC compliance, it's crucial to follow proper PCB design and layout guidelines, use shielding and filtering where necessary, and ensure that the device is operated within its specified frequency range.
  • To troubleshoot issues with the device not functioning as expected, start by verifying the power supply voltage and current, checking for proper PCB layout and design, and ensuring that the device is operated within its specified ratings. Use oscilloscopes and logic analyzers to debug the issue.
  • To prevent damage, store the devices in their original packaging, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the pins, and use anti-static wrist straps and mats when handling the devices.

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DN2625K4-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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