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DN3765K4-G - Microchip

Description: Microchip DN3765K4-G N-channel MOSFET Transistor, 0.3 A, 650 V Depletion, 3-Pin TO-252

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PCB Footprints
DN3765K4-G - Microchip PCB footprint - Other - Other - 3-Lead TO-252 (D-PAK) Package Outline (K4)
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3D Models
DN3765K4-G - Microchip  - 3D model - Other - 3-Lead TO-252 (D-PAK) Package Outline (K4)
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DN3765K4-G Details

  • Manufacturer Part Number:

    DN3765K4-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    DPAK-3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    0.3 A

  • Drain-source On Resistance-Max:

    8 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    110 pF

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    0.5 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    175 ns

  • Turn-on Time-Max (ton):

    125 ns

DN3765K4-G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Implement a robust power-on reset circuit, ensure a stable clock source, and use a reliable voltage regulator. Also, consider using a temperature sensor to monitor the device temperature.
  • Use a combination of ceramic and electrolytic capacitors for decoupling, with a total capacitance of at least 10uF. Place the capacitors close to the power pins and use a low-ESR capacitor for the core voltage.
  • Use a high-quality clock source, such as a crystal oscillator or a low-jitter clock generator. Implement a clock tree with minimal routing and use a clock buffer to reduce skew.
  • Use a shielded enclosure, ensure good PCB layout practices, and use EMI filters or common-mode chokes on I/O lines. Also, consider using a spread-spectrum clock generator to reduce EMI.

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DN3765K4-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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