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DS1023S-500+ - Analog Devices

Description: DS1023S-500+, Delay Line, 8-Taps 63.75ns, 16-Pin SOIC

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DS1023S-500+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16 SOIC
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DS1023S-500+ - Analog Devices  - 3D model - Small Outline Packages - 16 SOIC
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DS1023S-500+ Details

  • Manufacturer Part Number:

    DS1023S-500+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-SOIC_W-300_MIL

  • Package Description:

    0.300 INCH, SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-SOIC_W-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2000-02-23

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Family:

    CMOS/TTL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Logic IC Type:

    SILICON DELAY LINE

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Taps/Steps:

    255

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    60 mA

  • Programmable Delay Line:

    YES

  • Prop. Delay@Nom-Sup:

    1292 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Total Delay-Nom (td):

    1038 ns

  • Width:

    7.5 mm

DS1023S-500+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS1023S-500+ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • The DS1023S-500+ requires a single 5V power supply. A 0.1uF decoupling capacitor should be placed as close as possible to the device, and a 10uF bulk capacitor should be placed near the power supply. The power supply should be able to provide a minimum of 100mA of current.
  • The maximum clock frequency for the DS1023S-500+ is 500MHz. However, the actual clock frequency used may be limited by the specific application and the quality of the clock signal.
  • The DS1023S-500+ has a parallel interface that can be connected to a microcontroller or FPGA. The interface consists of 10-bit data output, a clock output, and a data ready output. The microcontroller or FPGA should be configured to read the data output on the rising edge of the clock output, and to wait for the data ready output to go high before reading the data.
  • The typical power consumption of the DS1023S-500+ is 250mW, assuming a 5V power supply and a 500MHz clock frequency. However, the actual power consumption may vary depending on the specific application and operating conditions.

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DS1023S-500+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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