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DS1100U-200+W - Analog Devices

Description: Delay Line

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DS1100U-200+W - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 21-0036
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DS1100U-200+W - Analog Devices  - 3D model - Small Outline Packages - 21-0036
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DS1100U-200+W Details

  • Manufacturer Part Number:

    DS1100U-200+W

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MICRO PACKAGE-8

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Family:

    1100

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Logic IC Type:

    SILICON DELAY LINE

  • Number of Functions:

    1

  • Number of Taps/Steps:

    5

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Power Supply Current-Max (ICC):

    50 mA

  • Programmable Delay Line:

    NO

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Total Delay-Nom (td):

    200 ns

  • Width:

    3 mm

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DS1100U-200+W Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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