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DS24B33S+ - Analog Devices

Description: EEPROM 1-WIRE 4KB EEPROM W/200K WRITE/ERASE CYCLE

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DS24B33S+ - Analog Devices - PCB symbol
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PCB Footprints
DS24B33S+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - W8+2
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3D Models
DS24B33S+ - Analog Devices - 3D model - Small Outline Packages - W8+2
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DS24B33S+ Details

  • Manufacturer Part Number:

    DS24B33S+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_W-300_MIL

  • Package Description:

    0.208 INCH, ROHS COMPLIANT, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_W-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2011-04-21

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Endurance:

    50000 Write/Erase Cycles

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5.31 mm

  • Memory Density:

    4096 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    1

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4KX1

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.13 mm

  • Serial Bus Type:

    1-WIRE

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.285 mm

DS24B33S+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS24B33S+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce noise and improve performance.
  • To ensure accurate temperature measurements, it's essential to calibrate the device, use a high-accuracy voltage reference, and minimize thermal gradients on the PCB. Additionally, using a thermocouple or other temperature sensor with a high accuracy and low thermal mass can help to improve measurement accuracy.
  • The maximum cable length for the 1-Wire interface of the DS24B33S+ is approximately 100 meters, but this can vary depending on the cable quality, noise environment, and other factors. It's recommended to use a high-quality cable with a shielded twisted pair and to follow proper termination and routing practices to minimize signal degradation.
  • Yes, the DS24B33S+ can be used in a multi-drop configuration, but it's essential to ensure that each device has a unique ROM code and that the master device can handle the increased bus capacitance. Additionally, using a repeater or a buffer can help to improve signal integrity and reduce the risk of signal degradation.
  • To troubleshoot issues with the DS24B33S+, start by verifying the power supply and clock signals, then check the 1-Wire bus for signal integrity and noise. Use a logic analyzer or oscilloscope to capture and analyze the 1-Wire signals, and consult the datasheet and application notes for guidance on troubleshooting common issues.

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DS24B33S+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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