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DSDI60-16A - LITTELFUSE

Description: Rectifiers 1600V 63A

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Symbol
DSDI60-16A - LITTELFUSE - PCB symbol
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PCB Footprints
DSDI60-16A - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-2
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3D Models
DSDI60-16A - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-247-2
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DSDI60-16A Details

  • Manufacturer Part Number:

    DSDI60-16A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Additional Feature:

    HIGH RELIABILITY, LOW NOISE, FREE WHEELING DIODE, SNUBBER DIODE

  • Application:

    FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    3.7 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    500 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    63 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    312 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1600 V

  • Reverse Recovery Time-Max:

    0.04 µs

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DSDI60-16A Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DSDI60-16A is a standard SOT23 package with a minimum pad size of 1.5mm x 1.5mm and a maximum pad size of 2.5mm x 2.5mm, with a 0.5mm spacing between pads.
  • Yes, the DSDI60-16A is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated for temperature to avoid thermal runaway.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a hot air gun to solder the device, and avoid applying excessive force or pressure during the soldering process.
  • The DSDI60-16A should be stored in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 40% to 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
  • Yes, the DSDI60-16A can be used in parallel to increase current handling, but it's essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize current imbalance and thermal mismatch.

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DSDI60-16A Overview

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