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DSDI60-18A - LITTELFUSE

Description: Rectifiers 1800V 63A

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PCB Footprints
DSDI60-18A - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 AD-
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3D Models
DSDI60-18A - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247 AD-
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DSDI60-18A Details

  • Manufacturer Part Number:

    DSDI60-18A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Additional Feature:

    HIGH RELIABILITY, LOW NOISE, FREE WHEELING DIODE, SNUBBER DIODE

  • Application:

    FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    3.7 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    500 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    63 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    312 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1800 V

  • Reverse Recovery Time-Max:

    0.04 µs

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DSDI60-18A Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for DSDI60-18A is a standard SOT-223 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • While the DSDI60-18A is rated for operation up to 150°C, it's essential to consider the derating curves and ensure the device doesn't exceed its maximum junction temperature (Tj) of 150°C. Additionally, the device's reliability and lifespan may be affected by prolonged exposure to high temperatures.
  • To ensure proper soldering, follow the recommended soldering profile: peak temperature of 260°C, soldering time of 10-15 seconds, and a soldering iron with a temperature range of 220-240°C. Also, ensure the PCB is clean and free of oxidation, and use a solder with a melting point above 217°C.
  • The DSDI60-18A has a maximum surge current rating of 60A for 10/1000μs, as specified in the datasheet. However, it's essential to consider the application's specific requirements and ensure the device is not subjected to repetitive surges that may affect its reliability.
  • While it's technically possible to use multiple DSDI60-18A devices in parallel, it's not recommended due to potential mismatch and uneven current sharing between devices. Instead, consider using a single device with a higher current rating or exploring alternative solutions that can handle the required current.

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DSDI60-18A Overview

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