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DSEP12-12A - LITTELFUSE

Description: IXYS SEMICONDUCTOR - DSEP12-12A - Fast / Ultrafast Diode, 1.2 kV, 15 A, Single, 1.79 V, 40 ns, 90 A

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PCB Footprints
DSEP12-12A - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220
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3D Models
DSEP12-12A - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-220
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DSEP12-12A Details

  • Manufacturer Part Number:

    DSEP12-12A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-220AC, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.95

  • Additional Feature:

    FREE WHEELING DIODE, SNUBBER DIODE

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.65 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    90 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    90 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Recovery Time-Max:

    0.04 µs

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DSEP12-12A Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DSEP12-12A is a rectangular pad with dimensions of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
  • Yes, the DSEP12-12A is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder to the pads. Avoid applying excessive force or heat, which can damage the device.
  • The DSEP12-12A has a maximum surge current rating of 100A for 10ms, making it suitable for applications that require protection against high-voltage transients.
  • Yes, the DSEP12-12A can be used in parallel to increase the current rating, but it is essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize current imbalance and thermal mismatch.

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DSEP12-12A Overview

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