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DSPB56721CAF - NXP

Description: Multi-Core Audio Processors

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DSPB56721CAF - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT823-3 - 80-Lead LQFP
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DSPB56721CAF - NXP  - 3D model - Quad Flat Packages - SOT823-3 - 80-Lead LQFP
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DSPB56721CAF Details

  • Manufacturer Part Number:

    DSPB56721CAF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    14 X 14 MM, 1.40 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-80

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 3.3V I/O SUPPLY

  • Barrel Shifter:

    NO

  • Bit Size:

    24

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    200 MHz

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

DSPB56721CAF Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN11524. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • The DSPB56721CAF has various power-saving modes and configuration options. Refer to the device's user manual and application notes (e.g., AN11525) for guidance on configuring the device for optimal power consumption. Additionally, consider using NXP's Power Estimation Tool to estimate power consumption based on your specific use case.
  • The IVR settings depend on the specific application and operating conditions. NXP provides guidelines for IVR configuration in the device's user manual and application notes (e.g., AN11526). It's essential to follow these guidelines to ensure stable operation and prevent damage to the device.
  • The DSPB56721CAF has various security features, including secure boot, encryption, and access control. NXP provides detailed information on implementing and optimizing these features in their security documentation and application notes (e.g., AN11527). It's crucial to follow these guidelines to ensure the security and integrity of your system.
  • The device's peripherals have specific limitations and considerations, such as baud rate limitations, clock domain crossing, and bus contention. Refer to the device's user manual and application notes (e.g., AN11528) for detailed information on using the peripherals effectively and avoiding common pitfalls.

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DSPB56721CAF Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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