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DSPIC30F2010-30I/SOG - Microchip

Description: Digital Signal Controller

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DSPIC30F2010-30I/SOG - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (SO)28-Lead(SOIC)
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DSPIC30F2010-30I/SOG Details

  • Manufacturer Part Number:

    DSPIC30F2010-30I/SOG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-28

  • Pin Count:

    28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    6.6

  • Has ADC:

    YES

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of External Interrupts:

    3

  • Number of I/O Lines:

    20

  • Number of Terminals:

    28

  • Number of Timers:

    3

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    512

  • RAM (words):

    512

  • ROM (words):

    4096

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.65 mm

  • Speed:

    30 MHz

  • Supply Current-Max:

    300 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC30F2010-30I/SOG Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the DSPIC30F2010 is 30 MHz, but it can be overclocked to 40 MHz with some limitations.
  • The oscillator can be configured using the FOSC register. The FOSC register is used to select the oscillator mode, frequency range, and clock source. Refer to the datasheet for more information on the FOSC register.
  • The Phase-Locked Loop (PLL) is used to multiply the clock frequency of the oscillator to generate a higher frequency clock signal. This allows the microcontroller to operate at a higher frequency while still using a lower frequency oscillator.
  • The ADC module in the DSPIC30F2010 can be used to convert analog signals to digital signals. The ADC module is configured using the ADCON registers. The ADCON registers are used to select the ADC channel, set the ADC clock, and start the ADC conversion. Refer to the datasheet for more information on the ADC module.
  • The maximum current that can be sourced or sunk by the I/O pins of the DSPIC30F2010 is 25 mA. However, the total current sourced or sunk by all I/O pins should not exceed 200 mA.

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DSPIC30F2010-30I/SOG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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