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dsPIC30F2012-20I/ML - Microchip

Description: MCU&DSP Sensor 12K Flash 1K RAM QFN28

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dsPIC30F2012-20I/ML - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - (ML) 28-Lead 6x6mm [QFN]
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dsPIC30F2012-20I/ML - Microchip  - 3D model - Quad Flat No-Lead - (ML) 28-Lead 6x6mm [QFN]
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dsPIC30F2012-20I/ML Details

  • Manufacturer Part Number:

    DSPIC30F2012-20I/ML

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, MO-220, QFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    VQFN-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES AT 2.5V SUPPLY AT 7.5MHZ

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    40 MHz

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    28

  • On Chip Program ROM Width:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.24SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

dsPIC30F2012-20I/ML Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 7.37 MHz (FRC oscillator) or 31.25 kHz (LPRC oscillator). However, the device can be clocked up to 40 MIPS using an external oscillator or clock source.
  • To configure the oscillator for optimal performance, you need to select the correct oscillator mode, frequency, and startup time. You can do this by setting the appropriate bits in the Oscillator Control Register (OSCCON) and the Oscillator Startup Timer Register (OST). Refer to the datasheet for more information.
  • The maximum amount of current that can be sourced or sunk by the I/O pins is 25 mA. However, the total current sourced or sunk by all I/O pins should not exceed 200 mA to prevent overheating and damage to the device.
  • To implement a watchdog timer in your application, you need to enable the watchdog timer by setting the WDTEN bit in the RCON register. You can then set the watchdog timer period using the WDTPS bits in the WDTCON register. The watchdog timer will reset the device if it is not periodically cleared using the CLRWDT or SLEEP instructions.
  • The Phase-Locked Loop (PLL) in the DSPIC30F2012-20I/ML is used to multiply the clock frequency of the internal oscillator or an external clock source to generate a higher frequency clock signal. This allows the device to operate at higher speeds while maintaining a stable clock signal.

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dsPIC30F2012-20I/ML Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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