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dsPIC30F2012-20I/SO - Microchip

Description: MCU&DSP Sensor 12K Flash 1K RAM SOIC28

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PCB Footprints
dsPIC30F2012-20I/SO - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 28-LAED PLASTIC SMALL OUTLINE  (SO) -WIDE, 7.50MM BODY [SOIC]
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3D Models
dsPIC30F2012-20I/SO - Microchip  - 3D model - Small Outline Packages - 28-LAED PLASTIC SMALL OUTLINE  (SO) -WIDE, 7.50MM BODY [SOIC]
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dsPIC30F2012-20I/SO Details

  • Manufacturer Part Number:

    DSPIC30F2012-20I/SO

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    0.300 INCH, PLASTIC, SOIC-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SOIC-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES AT 2.5V SUPPLY AT 7.5MHZ

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    40 MHz

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    28

  • On Chip Program ROM Width:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

dsPIC30F2012-20I/SO Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 7.37 MHz (FRC oscillator) or 31 kHz (LPRC oscillator). However, the device can be clocked up to 40 MIPS using an external oscillator or clock source.
  • To configure the oscillator for optimal performance, set the FOSC2:FOSC0 bits in the OSCCON register to select the desired oscillator mode, and adjust the OSCTUNE register to fine-tune the oscillator frequency. Additionally, ensure that the oscillator capacitors are properly connected and meet the recommended specifications.
  • The maximum amount of current that can be sourced or sunk by the I/O pins is 25 mA per pin, with a total current limit of 200 mA for all I/O pins combined.
  • To implement a watchdog timer, set the WDTCON register to enable the watchdog timer, and configure the WDTPS bits to set the timeout period. The watchdog timer can be cleared by writing a specific sequence to the WDTCLR register. Ensure that the watchdog timer is regularly cleared in your application to prevent a reset.
  • The Phase-Locked Loop (PLL) is used to multiply the input clock frequency to generate a higher clock frequency for the CPU and peripherals. This allows the device to operate at higher speeds while maintaining a lower input clock frequency.

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dsPIC30F2012-20I/SO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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