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DSPIC30F3013-20E/ML - Microchip

Description: MCU 16-bit dsPIC RISC 24KB Flash 3.3V/5V Automotive 44-Pin QFN EP Tube

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DSPIC30F3013-20E/ML - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - (ML) 44-Lead(QFN)
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DSPIC30F3013-20E/ML - Microchip  - 3D model - Quad Flat No-Lead - (ML) 44-Lead(QFN)
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DSPIC30F3013-20E/ML Details

  • Manufacturer Part Number:

    DSPIC30F3013-20E/ML

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    8 X 8 MM, PLASTIC, MO-220, QFN-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    QFN-44

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15MHZ

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    40 MHz

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQCC-N44

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    44

  • On Chip Program ROM Width:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC44,.31SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC30F3013-20E/ML Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 7.37 MHz (FRC oscillator) or 31.25 kHz (LPRC oscillator). However, the device can be clocked up to 40 MIPS using an external oscillator or clock source.
  • To configure the oscillator for optimal performance, you need to select the correct oscillator mode, frequency range, and clock source. You can do this by setting the appropriate bits in the Oscillator Control Register (OSCCON) and the Clock Control Register (CLKDIV). Refer to the datasheet for more information.
  • The maximum amount of current that can be sourced or sunk by the I/O pins is 25 mA. However, the total current sourced or sunk by all I/O pins should not exceed 200 mA to prevent overheating and damage to the device.
  • To implement a watchdog timer in your application, you need to enable the watchdog timer module, set the watchdog timer period, and periodically reset the watchdog timer using the CLRWDT or SLEEP instructions. Refer to the datasheet for more information on watchdog timer configuration and usage.
  • The Brown-out Reset (BOR) module is used to reset the device when the supply voltage falls below a certain threshold. This helps to prevent the device from operating erratically or unpredictably during power-on or power-down sequences.

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DSPIC30F3013-20E/ML Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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