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DSPIC30F4011T-20I/PT - Microchip

Description: MCU 16-bit dsPIC RISC 48KB Flash 3.3V/5V Automotive 44-Pin TQFP T/R

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DSPIC30F4011T-20I/PT - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 44-LEAD PLASTIC THIN QUAD FLATPACK (PT)[TQFP]
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DSPIC30F4011T-20I/PT - Microchip  - 3D model - Quad Flat Packages - 44-LEAD PLASTIC THIN QUAD FLATPACK (PT)[TQFP]
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DSPIC30F4011T-20I/PT Details

  • Manufacturer Part Number:

    DSPIC30F4011T-20I/PT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    10 X 10 MM, 1 MM HEIGHT, PLASTIC, TQFP-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    TQFP-44

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    40 MHz

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G44

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    44

  • On Chip Program ROM Width:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TQFP

  • Package Equivalence Code:

    TQFP44,.39SQ,31

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC30F4011T-20I/PT Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 7.37 MHz (FRC oscillator) or 31.25 kHz (LPRC oscillator). However, the device can be clocked up to 40 MIPS using an external oscillator or clock source.
  • To configure the oscillator for optimal performance, you need to select the correct oscillator mode, frequency, and startup time. You can do this by setting the corresponding bits in the Oscillator Control Register (OSCCON). Additionally, you may need to add external components, such as capacitors or crystals, depending on the oscillator mode chosen.
  • The DSPIC30F4011T-20I/PT has 2048 bytes of RAM and 48 KB of flash memory.
  • The watchdog timer can be implemented using the Windowed Watchdog Timer (WWDT) module. You need to configure the WWDT period, window, and enable the timer. You can do this by setting the corresponding bits in the WWDT Control Register (RCON) and WWDT Period Register (WP).
  • Yes, the DSPIC30F4011T-20I/PT has a 10-bit, 12-channel ADC that can be used to convert analog signals from external sensors. You need to configure the ADC module, select the correct channel, and set the conversion mode. You can then read the converted digital value from the ADC result register.

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DSPIC30F4011T-20I/PT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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