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DSPIC33CK32MC102-E/SS - Microchip

Description: dsPIC Automotive, AEC-Q100, dsPIC™ 33CK, Functional Safety (FuSa) Microcontroller IC 16-Bit 100MHz 32KB (32K x 8) FLASH 28-SSOP

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DSPIC33CK32MC102-E/SS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 28-Lead Plastic Shrink Small Outline (SS) - 5.30 mm Body [SSOP]
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3D Models
DSPIC33CK32MC102-E/SS - Microchip  - 3D model - Small Outline Packages - 28-Lead Plastic Shrink Small Outline (SS) - 5.30 mm Body [SSOP]
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DSPIC33CK32MC102-E/SS Details

  • Manufacturer Part Number:

    DSPIC33CK32MC102-E/SS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    28

  • Manufacturer Package Code:

    SSOP-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2020-08-12

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    20

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    64 MHz

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    4

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    28

  • Number of Timers:

    3

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • RAM (words):

    8192

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    29.6 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC33CK32MC102-E/SS Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be achieved with an external crystal oscillator is 40 MHz. However, the device can operate up to 100 MHz with a Phase-Locked Loop (PLL) clock multiplier.
  • To configure the device for low power consumption, you can use the Power-Saving Modes (PSM) feature, which includes Sleep, Idle, and Doze modes. You can also use the Peripheral Module Disable (PMD) feature to disable unused peripherals, and adjust the clock frequency and voltage regulator settings to minimize power consumption.
  • Yes, the DSPIC33CK32MC102-E/SS has an External Memory Interface (EMI) that allows you to connect external memory devices, such as flash memory or SRAM, to the device. The EMI supports up to 16-bit data bus width and up to 24-bit address bus width.
  • The DSPIC33CK32MC102-E/SS has a built-in Watchdog Timer (WDT) module that can be used to reset the device in case of a software fault or hang-up. The WDT can be configured to generate a reset signal after a specified timeout period, and can be enabled or disabled using the WDT control registers.
  • The DSPIC33CK32MC102-E/SS has 32 KB of flash memory and 4 KB of RAM.

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DSPIC33CK32MC102-E/SS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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