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DSPIC33EP128MC206-E/MR - Microchip

Description: MCU 16-bit dsPIC RISC 128KB Flash 3.3V Automotive 64-Pin QFN EP Tube

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PCB Footprints
DSPIC33EP128MC206-E/MR - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 64-LEAD PLASTIC QUAD FLAT, NO LEAD PACKAGE (MR) - 9X9X0.9 MM BODY WITH 5.40 X 5.40 WXPOSED PAD [QFN]-202
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3D Models
DSPIC33EP128MC206-E/MR - Microchip  - 3D model - Quad Flat No-Lead - 64-LEAD PLASTIC QUAD FLAT, NO LEAD PACKAGE (MR) - 9X9X0.9 MM BODY WITH 5.40 X 5.40 WXPOSED PAD [QFN]-202
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DSPIC33EP128MC206-E/MR Details

  • Manufacturer Part Number:

    DSPIC33EP128MC206-E/MR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    9 X 9 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFN-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    QFN-64

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    60 MHz

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e3

  • Length:

    9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    3

  • Number of Terminals:

    64

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    16384

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC33EP128MC206-E/MR Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the DSPIC33EP128MC206-E/MR is 70 MIPS (140 MHz clock frequency).
  • The oscillator can be configured using the FOSCSEL (Oscillator Select) bits in the FOSC (Oscillator Control) register. The oscillator can be set to use an external crystal, internal Fast RC (FRC) oscillator, or internal Low Power RC (LPRC) oscillator.
  • The DSPIC33EP128MC206-E/MR has 128 KB of Flash memory and 8 KB of RAM.
  • The watchdog timer can be implemented using the WDT (Watchdog Timer) module. The WDT can be enabled and configured using the WDTCON (Watchdog Timer Control) register. The WDT can be set to reset the microcontroller or generate an interrupt if the timer expires.
  • The DSPIC33EP128MC206-E/MR has several sleep modes, including Idle, Sleep, and Deep Sleep. These modes can be used to reduce power consumption when the microcontroller is not actively executing code.

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DSPIC33EP128MC206-E/MR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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