DSPIC33EP256GP502-I/MM - Microchip

DSPIC33EP256GP502-I/MM Details

• Manufacturer Part Number:

  DSPIC33EP256GP502-I/MM

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  QFN

• Package Description:

  6 X 6 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, QFN-28

• Pin Count:

  28

• Manufacturer Package Code:

  QFN-S-28

• Country Of Origin:

  Thailand

• ECCN Code:

  3A991.a.2

• HTS Code:

  8542.31.00.35

• Factory Lead Time:

  6 Weeks

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  14

• Barrel Shifter:

  YES

• Bit Size:

  16

• Boundary Scan:

  YES

• Clock Frequency-Max:

  60 MHz

• Format:

  FIXED POINT

• Integrated Cache:

  NO

• Internal Bus Architecture:

  MULTIPLE

• JESD-30 Code:

  S-PQCC-N28

• JESD-609 Code:

  e3

• Length:

  6 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  1

• Number of DMA Channels:

  4

• Number of External Interrupts:

  3

• Number of Terminals:

  28

• Number of Timers:

  5

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVQCCN

• Package Equivalence Code:

  LCC28,.24SQ,25

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (words):

  32768

• ROM Programmability:

  FLASH

• Screening Level:

  TS 16949

• Seated Height-Max:

  1 mm

• Supply Current-Max:

  55 mA

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  6 mm

• uPs/uCs/Peripheral ICs Type:

  DIGITAL SIGNAL PROCESSOR, CONTROLLER