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DSPIC33EP32GS506-I/PT - Microchip

Description: MICROCHIP - DSPIC33EP32GS506-I/PT - DSC, 16BIT, 32KB, 140MHZ, 3.6V, TQFP-64

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DSPIC33EP32GS506-I/PT - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP]
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DSPIC33EP32GS506-I/PT - Microchip  - 3D model - Quad Flat Packages - 64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP]
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DSPIC33EP32GS506-I/PT Details

  • Manufacturer Part Number:

    DSPIC33EP32GS506-I/PT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    TQFP-64

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Has ADC:

    YES

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    60 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of External Interrupts:

    4

  • Number of I/O Lines:

    53

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    64

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP64,.47SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    4096

  • RAM (words):

    4096

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    82 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC33EP32GS506-I/PT Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the DSPIC33EP32GS506-I/PT is 70 MIPS (instructions per second).
  • The DSPIC33EP32GS506-I/PT has 32 KB of flash memory.
  • The maximum operating temperature of the DSPIC33EP32GS506-I/PT is +125°C.
  • Yes, the DSPIC33EP32GS506-I/PT has a 10-bit, 12-channel Analog-to-Digital Converter (ADC).
  • Yes, the DSPIC33EP32GS506-I/PT has several low-power modes, including Sleep, Idle, and Doze, to reduce power consumption.

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DSPIC33EP32GS506-I/PT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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