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DSPIC33EP512MU810T-I/PF - Microchip

Description: MCU 16-bit dsPIC RISC 536KB Flash 3.3V 100-Pin TQFP T/R

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DSPIC33EP512MU810T-I/PF - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP](1.2)
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DSPIC33EP512MU810T-I/PF - Microchip  - 3D model - Quad Flat Packages - 100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP](1.2)
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DSPIC33EP512MU810T-I/PF Details

  • Manufacturer Part Number:

    DSPIC33EP512MU810T-I/PF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    TQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    TQFP-100

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    60 MHz

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    15

  • Number of External Interrupts:

    5

  • Number of Terminals:

    100

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    53248

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    320 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC33EP512MU810T-I/PF Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the DSPIC33EP512MU810T-I/PF is 70 MIPS (instructions per second) at 3.0V and 25°C.
  • The DSPIC33EP512MU810T-I/PF has 512 KB of flash memory.
  • The operating voltage range of the DSPIC33EP512MU810T-I/PF is 2.5V to 5.5V.
  • Yes, the DSPIC33EP512MU810T-I/PF has a built-in oscillator that can be used as a clock source.
  • The maximum current consumption of the DSPIC33EP512MU810T-I/PF is 35 mA at 3.0V and 25°C.

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DSPIC33EP512MU810T-I/PF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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