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E3D30065D - Wolfspeed

Description: 650 V, 30 A, TO-247-3 package, Automotive qualified, Discrete SiC Schottky Diode

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PCB Footprints
E3D30065D - Wolfspeed PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-3L
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3D Models
E3D30065D - Wolfspeed  - 3D model - Transistor Outline, Vertical - TO-247-3L
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E3D30065D Details

  • Manufacturer Part Number:

    E3D30065D

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    42 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    179 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    95 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

E3D30065D Frequently Asked Questions (FAQs)

  • Wolfspeed recommends a PCB layout with a thermal pad connected to a large copper area for heat dissipation. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K should be used between the device and the heat sink.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions and derating guidelines. The device should be operated within the specified junction temperature (Tj) range, and the thermal design should be optimized to minimize thermal resistance. Additionally, the device should be stored and handled according to Wolfspeed's recommended storage and handling procedures.
  • Wolfspeed recommends following the JEDEC J-STD-020D.1 standard for soldering and assembly. The device should be soldered using a solder with a melting point above 217°C, and the peak reflow temperature should not exceed 260°C. Additionally, the device should be handled and stored according to Wolfspeed's recommended storage and handling procedures.
  • To troubleshoot and debug issues with the E3D30065D, it is essential to follow a systematic approach. First, verify that the device is properly soldered and assembled. Then, check the power supply and input signals to ensure they are within the specified range. Use oscilloscopes and other diagnostic tools to identify any anomalies in the device's behavior. Finally, consult Wolfspeed's application notes and technical support resources for guidance on specific issues.
  • The E3D30065D is designed to meet the radiation hardness requirements of various industries, including aerospace and defense. However, the specific radiation hardness and EMC characteristics of the device are not publicly disclosed due to their sensitive nature. Customers should contact Wolfspeed's technical support team for more information on these topics.

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E3D30065D Overview

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