Wolfspeed recommends a 2-layer PCB with a thermal via array under the device to dissipate heat. A minimum of 10 thermal vias with a diameter of 0.3 mm, spaced 1.2 mm apart, is recommended. Additionally, a thermal pad with a minimum size of 3.5 mm x 3.5 mm is suggested.
To ensure reliable operation at high temperatures, it's essential to follow Wolfspeed's recommended thermal management guidelines. This includes using a heat sink, thermal interface material, and ensuring good airflow around the device. Additionally, derating the device's power output at high temperatures is recommended to prevent overheating.
The E3M0120090J can withstand voltage transients up to 120% of the maximum rated voltage for a duration of 100 ms. However, it's recommended to limit voltage transients to 110% of the maximum rated voltage to ensure reliable operation and prevent damage to the device.
Wolfspeed recommends following standard ESD protection procedures when handling the E3M0120090J. This includes using ESD-safe workstations, wrist straps, and packaging materials. Additionally, the device should be stored in its original packaging or an ESD-safe container when not in use.
Wolfspeed recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. The device should be soldered using a solder with a melting point of 217°C (423°F) or higher.
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E3M0120090J Overview
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