For optimal performance, it's recommended to follow a star-point PCB layout, keeping the high-current paths short and wide. Ensure good thermal management by providing a sufficient heat sink and thermal interface material. A minimum of 2 oz copper thickness is recommended for the PCB.
To select the correct heat sink, consider the device's power dissipation, ambient temperature, and airflow. A heat sink with a thermal resistance of 5-10°C/W is recommended. You can use Ohmite's heat sink selection guide or consult with a thermal expert for specific recommendations.
The internal ESD protection diodes are designed to withstand up to 2 kV human body model (HBM) and 150 V machine model (MM) electrostatic discharges. However, it's recommended to follow proper ESD handling procedures to prevent damage.
While the EBWB-NR0010FET is a high-quality device, it's essential to consult with Ohmite's sales team or a qualified representative to discuss specific requirements and ensure the device meets the necessary standards and certifications for high-reliability or aerospace applications.
Store the devices in their original packaging or in a dry, nitrogen-filled environment. Avoid exposing the devices to moisture, and follow the recommended baking procedure before soldering if the devices have been stored for an extended period.
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EBWB-NR0010FET Overview
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