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ECS-.327-12.5-39-TR - ECS

Description: Crystals 32.768KHz 12.5pF 20ppm -40C +85C

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ECS-.327-12.5-39-TR - ECS PCB footprint - Other - Other - ECS-.327-12.5-39-TR-1
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ECS-.327-12.5-39-TR Details

  • Manufacturer Part Number:

    ECS-.327-12.5-39-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    ECS International Inc

  • YTEOL:

    0

  • Aging:

    3 PPM/FIRST YEAR

  • Crystal/Resonator Type:

    PARALLEL - FUNDAMENTAL

  • Drive Level:

    0.1 µW

  • Frequency Stability:

    0.0144%

  • Frequency Tolerance (MHz):

    20

  • JESD-609 Code:

    e4

  • Load Capacitance:

    12.5 pF

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Frequency-Nom:

    0.032768 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    TR, 7 INCH

  • Physical Dimension:

    4.9mm x 1.8mm x 1.0mm

  • Series Resistance:

    70000 Ω

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

ECS-.327-12.5-39-TR Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the ECS-.327-12.5-39-TR near a thermal pad or heat sink to dissipate heat efficiently. A minimum of 2oz copper thickness and a 1-inch square thermal pad is recommended. Additionally, ensure good airflow around the component to prevent overheating.
  • To ensure reliability and longevity in high-vibration environments, it's essential to follow proper mounting and soldering techniques. Use a robust PCB design, secure the component with a suitable adhesive or mechanical fastening, and ensure the solder joints are strong and reliable.
  • Store the ECS-.327-12.5-39-TR in its original packaging or a similar ESD-protective container. Avoid exposing the component to extreme temperatures, humidity, or physical stress. Handle the component by the body, avoiding touching the pins or electrical connections.
  • The ECS-.327-12.5-39-TR is rated for operation up to 125°C. However, the component's performance and lifespan may degrade above 100°C. Ensure proper thermal management and derate the component's power handling accordingly to prevent overheating.
  • Use a soldering iron with a temperature range of 220°C to 250°C. Apply a small amount of solder paste or flux to the PCB pads. Use a gentle, sweeping motion to solder the component, avoiding excessive heat or cold solder joints.

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ECS-.327-12.5-39-TR Overview

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