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ECS-200-12-33Q-JES-TR - ECS

Description: 20 MHz ±20ppm Crystal 12pF 60 Ohms 4-SMD, No Lead

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PCB Footprints
ECS-200-12-33Q-JES-TR - ECS PCB footprint - Other - Other - ECS-200-12-33Q-JES-TR-2
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3D Models
ECS-200-12-33Q-JES-TR - ECS  - 3D model - Other - ECS-200-12-33Q-JES-TR-2
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ECS-200-12-33Q-JES-TR Details

  • Manufacturer Part Number:

    ECS-200-12-33Q-JES-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMD, 4 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    ECS International Inc

  • YTEOL:

    7

  • Additional Feature:

    AEC-Q200 QUALIFIED; TR, 7 INCH

  • Aging:

    5 PPM/FIRST YEAR

  • Crystal/Resonator Type:

    PARALLEL - FUNDAMENTAL

  • Drive Level:

    100 µW

  • Frequency Stability:

    0.005%

  • Frequency Tolerance (MHz):

    20

  • JESD-609 Code:

    e4

  • Load Capacitance:

    12 pF

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Frequency-Nom:

    20 MHz

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    TR

  • Physical Dimension:

    L3.2XB2.5XH0.8 (mm)/L0.126XB0.098XH0.031 (inch)

  • Series Resistance:

    60 Ω

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

ECS-200-12-33Q-JES-TR Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the ECS-200-12-33Q-JES-TR near a heat sink or a metal plate to dissipate heat. A thermal pad or thermal tape can be used to improve heat transfer. Additionally, ensuring good airflow and keeping the surrounding components at a safe distance can help maintain optimal performance.
  • To ensure reliability and longevity, it's essential to follow the recommended operating conditions, storage conditions, and handling procedures outlined in the datasheet. Additionally, using conformal coatings, potting, or encapsulation can help protect the device from moisture, vibration, and other environmental stressors.
  • Potential failure modes include overheating, electrical overstress, and mechanical stress. To mitigate these, ensure proper thermal management, operate within the recommended voltage and current ranges, and handle the device with care to avoid mechanical stress.
  • While the ECS-200-12-33Q-JES-TR is designed to be robust, it's essential to evaluate the device's performance in your specific application. Consider using additional mechanical support, such as potting or encapsulation, and ensure the device is securely mounted to the PCB to minimize the effects of vibration and shock.
  • To troubleshoot issues, start by verifying the power supply voltage, current, and temperature. Check for signs of overheating, electrical overstress, or mechanical damage. Use oscilloscopes or logic analyzers to monitor the device's behavior and identify potential faults. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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ECS-200-12-33Q-JES-TR Overview

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