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ECS-320-8-33B-7KM-TR - ECS

Description: Crystals 32MHz 8pF 40 ohms -20C to 70C 7ppm

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ECS-320-8-33B-7KM-TR - ECS PCB footprint - Other - Other - ECS-320-8-33B-7KM-TR-1
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ECS-320-8-33B-7KM-TR - ECS  - 3D model - Other - ECS-320-8-33B-7KM-TR-1
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ECS-320-8-33B-7KM-TR Details

  • Manufacturer Part Number:

    ECS-320-8-33B-7KM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMD, 4 PIN

  • HTS Code:

    8541.60.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    ECS International Inc

  • YTEOL:

    7.3

  • Aging:

    2 PPM/FIRST YEAR

  • Crystal/Resonator Type:

    PARALLEL - FUNDAMENTAL

  • Drive Level:

    200 µW

  • Frequency Stability:

    0.001%

  • Frequency Tolerance:

    7 ppm

  • JESD-609 Code:

    e4

  • Load Capacitance:

    8 pF

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Frequency-Nom:

    32 MHz

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Physical Dimension:

    3.2mm x 2.5mm x 0.8mm

  • Series Resistance:

    40 Ω

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

ECS-320-8-33B-7KM-TR Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the component away from high-current paths and heat sources. A thermal pad on the bottom of the component can be connected to a copper plane on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended for the PCB.
  • To ensure reliability in high-vibration environments, it's recommended to use a secure mounting method, such as screwing or adhesive bonding, to prevent the component from shifting or detaching. Additionally, conformal coating can be applied to protect the component from moisture and contaminants.
  • The component should be stored in a dry, cool place with a temperature range of -20°C to 40°C and humidity below 60%. Handling should be done with electrostatic discharge (ESD) protection, such as wrist straps or mats, to prevent damage.
  • While the component is designed to operate in environments with some EMI, it's recommended to take additional measures to shield the component and the PCB from strong EMI sources. This can include using EMI-absorbing materials, shielding cans, or Faraday cages.
  • The recommended soldering profile involves a peak temperature of 260°C, with a dwell time of 10-30 seconds. The component should be soldered using a solder with a melting point above 217°C, and the PCB should be preheated to 120°C to 150°C.

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ECS-320-8-33B-7KM-TR Overview

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