ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including derating the output current and voltage according to the temperature. Additionally, consider using a heat sink or thermal management system to keep the junction temperature below 125°C.
ROHM recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 1uF to 10uF, depending on the input voltage and output current requirements. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ripple.
To troubleshoot output voltage instability or oscillation issues, check the input voltage, output current, and PCB layout for any noise or resonance. Ensure that the output capacitor is properly selected and placed, and that the feedback network is correctly configured. Also, verify that the device is operated within the recommended operating conditions.
ROHM recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 1uF to 22uF, depending on the output current and voltage requirements. The capacitor should be placed as close to the VOUT pin as possible to minimize noise and ripple.
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EDZTE6127B Overview
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