EDZVFHT2R5.1B footprint, schematic symbol and 3D model by ROHM Semiconductor

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EDZVFHT2R5.1B Details

ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
The EDZVFHT2R5.1B requires a stable input voltage (Vin) and a proper bias voltage (Vb) to operate within its specified parameters. Ensure Vin is within the recommended range (4.5V to 5.5V) and Vb is set to 2.5V ± 0.5V.
ROHM recommends a 10uF to 22uF ceramic capacitor (X5R or X7R type) for input decoupling, placed as close to the device as possible.
The EDZVFHT2R5.1B has a built-in POR and BOR. Ensure your system design takes into account the reset timing and voltage thresholds to prevent unwanted resets or malfunctions.
The device has a thermal resistance (Rth) of 25°C/W. Ensure your PCB design and thermal management strategy can handle the device's power dissipation to prevent overheating.

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Use the download button to access the EDZVFHT2R5.1B schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like EDZVF, or try a keyword search, such as Zener Diodes

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