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EGP10B - onsemi

Description: High surge current capability; Superfast recovery time for high efficiency; Low leakage current; Low forward voltage, high current capability

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PCB Footprints
EGP10B - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - 1N4736A
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3D Models
EGP10B - onsemi  - 3D model - Diodes, Axial Diameter Horizontal Mounting - 1N4736A
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EGP10B Details

  • Manufacturer Part Number:

    EGP10B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Axial Lead / DO-41

  • Package Description:

    D4, 2 PIN

  • Manufacturer Package Code:

    017AH

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5.84

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    DO-41

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    2.5 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

EGP10B Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
  • Ensure proper heat sinking, use a thermally conductive interface material (e.g., thermal tape or thermal grease) between the device and heat sink, and follow the recommended operating conditions and derating guidelines in the datasheet.
  • The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage to the device.
  • Yes, the EGP10B can be used in switching applications, but it's essential to follow the recommended switching frequency, duty cycle, and gate drive requirements to prevent overheating and ensure reliable operation.
  • Handle the device with ESD-safe materials, use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected package. Also, follow proper PCB design and layout guidelines to minimize ESD susceptibility.

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EGP10B Overview

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Part Image EGP10B/23 Vishay Semiconductors

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Part Image EGP10BT26A Fairchild Semiconductor Corporation

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Part Image EGP10B.TR Fairchild Semiconductor Corporation

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For a full list of alternate parts for EGP10B, check out Findchips.com