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EGP10D - onsemi

Description: Superfast recovery time for high efficiency; High surge current capability; Low forward voltage, high current capability; Low leakage current

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PCB Footprints
EGP10D - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO41A
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3D Models
EGP10D - onsemi  - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO41A
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EGP10D Details

  • Manufacturer Part Number:

    EGP10D

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Axial Lead / DO-41

  • Package Description:

    D4, 2 PIN

  • Manufacturer Package Code:

    017AH

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.95

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    DO-41

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    2.5 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

EGP10D Frequently Asked Questions (FAQs)

  • A recommended PCB layout for EGP10D is to use a thermal pad with a minimum size of 2x2 mm, and to connect it to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure proper biasing, connect the gate to a voltage source through a resistor (e.g., 1 kΩ) and a capacitor (e.g., 100 nF) in parallel. This helps to stabilize the gate voltage and reduce noise.
  • The maximum SOA for EGP10D is defined by the voltage and current ratings. Ensure that the device operates within the specified voltage (up to 100 V) and current (up to 10 A) limits to prevent damage.
  • To protect the EGP10D from ESD, handle the device by the body or use an anti-static wrist strap. Ensure that the PCB and assembly process also follow ESD-safe practices.
  • Store EGP10D devices in their original packaging or in a dry, cool place. Avoid exposing the devices to moisture, direct sunlight, or extreme temperatures. Handle the devices by the body or use an anti-static wrist strap to prevent ESD damage.

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EGP10D Overview

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Part Image EGP10DH Zowie Technology Corp

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Part Image EGP10D-TP Micro Commercial Components

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Part Image HER103 Diodes Incorporated

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For a full list of alternate parts for EGP10D, check out Findchips.com