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EGP20A - onsemi

Description: Glass passivated cavity-free junction; Low leakage current; High surge current capability; Superfast recovery time for high efficiency; Low forward voltage, high current capability

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PCB Footprints
EGP20A - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO 204
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3D Models
EGP20A - onsemi  - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO 204
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EGP20A Details

  • Manufacturer Part Number:

    EGP20A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    AXIAL LEAD DO 204

  • Package Description:

    GLASS PACKAGE-2

  • Manufacturer Package Code:

    017AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5.84

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    50 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    DO-15

  • JESD-30 Code:

    O-LALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    3.13 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

EGP20A Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the EGP20A package to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • Although the datasheet doesn't specify a maximum voltage for the gate pin, it's generally recommended to keep the gate voltage between -5V and +20V to prevent damage to the internal gate oxide.
  • Yes, the EGP20A can be used in switching applications, but it's essential to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range to prevent overheating and reduce electromagnetic interference (EMI).
  • To protect the EGP20A from ESD, it's recommended to follow proper handling and storage procedures, use ESD-safe materials and equipment, and consider adding ESD protection devices, such as TVS diodes or ESD suppressors, to the circuit.

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EGP20A Overview

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