EGP20B footprint, schematic symbol and 3D model by onsemi

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PCB Footprints

EGP20B - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - AXIAL LEAD DO 204 CASE 017AJ ISSUE O

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Part Number EGP20B
Manufacturer onsemi
Pin Count 2
Part Category Diode
Package Category Diodes, Axial Diameter Horizontal Mounting
Footprint Name Diodes, Axial Diameter Horizontal Mounting - AXIAL LEAD DO 204 CASE 017AJ ISSUE O
Released Date Mar 29, 2023
Last Modified Date Jan 22, 2025 4:53 PM UTC
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EGP20B Details

Manufacturer Part Number:
EGP20B
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
AXIAL LEAD DO 204
Package Description:
GLASS PACKAGE-2
Manufacturer Package Code:
017AJ
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
18 Weeks
Manufacturer:
onsemi
YTEOL:
5.84
Additional Feature:
LOW LEAKAGE CURRENT
Application:
EFFICIENCY
Breakdown Voltage-Min:
100 V
Case Connection:
ISOLATED
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.95 V
JEDEC-95 Code:
DO-15
JESD-30 Code:
O-LALF-W2
JESD-609 Code:
e3
Non-rep Pk Forward Current-Max:
75 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-65 °C
Output Current-Max:
2 A
Package Body Material:
GLASS
Package Shape:
ROUND
Package Style:
LONG FORM
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Power Dissipation-Max:
3.13 W
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
100 V
Reverse Current-Max:
5 µA
Reverse Recovery Time-Max:
0.05 µs
Reverse Test Voltage:
100 V
Surface Mount:
NO
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
WIRE
Terminal Position:
AXIAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED

EGP20B Frequently Asked Questions (FAQs)

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
The EGP20B is rated for operation up to 150°C. To ensure reliable operation, it's essential to follow proper thermal design and layout guidelines, and to derate the device's power dissipation according to the temperature derating curve provided in the datasheet.
A gate drive voltage of 10-15V is recommended, with a current capability of at least 1A. This ensures fast switching times and minimizes power losses. The gate drive circuit should also be designed to provide a low inductance path to the gate terminal.
A transient voltage suppressor (TVS) or a zener diode can be used to clamp overvoltages. Overcurrent protection can be achieved using a current sense resistor and a comparator or an overcurrent protection IC. The device's built-in protection features, such as overtemperature shutdown and under-voltage lockout, should also be utilized.
A dead time of 100-200ns is typically recommended to prevent shoot-through currents and ensure reliable operation. The exact dead time value may vary depending on the specific application and switching frequency.

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EGP20B Overview

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