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EGP20D - onsemi

Description: Low leakage current; High surge current capability; Glass passivated cavity-free junction; Superfast recovery time for high efficiency; Low forward voltage, high current capability

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EGP20D - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - AXIAL LEAD DO 204 CASE 017AJ ISSUE O
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3D Models
EGP20D - onsemi  - 3D model - Diodes, Axial Diameter Horizontal Mounting - AXIAL LEAD DO 204 CASE 017AJ ISSUE O
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for EGP20D
  • Part Number EGP20D
  • Manufacturer onsemi
  • Pin Count 2
  • Part Category Diode
  • Package Category Diodes, Axial Diameter Horizontal Mounting
  • Footprint Name Diodes, Axial Diameter Horizontal Mounting - AXIAL LEAD DO 204 CASE 017AJ ISSUE O
  • Released Date Mar 30, 2021
  • Last Modified Date Jan 22, 2025 4:53 PM UTC
  • Pinout / Pin List Click Here (Member Only)

EGP20D Details

  • Manufacturer Part Number:

    EGP20D

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    AXIAL LEAD DO 204

  • Package Description:

    GLASS PACKAGE-2

  • Manufacturer Package Code:

    017AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.95

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    DO-15

  • JESD-30 Code:

    O-LALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Power Dissipation-Max:

    3.13 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

EGP20D Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The thermal pad should be connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
  • The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage.
  • Yes, the EGP20D can be used in switching applications, but ensure that the switching frequency is within the recommended range (typically up to 100 kHz) and that the device is properly snubbed to prevent ringing.
  • Use ESD protection devices, such as TVS diodes or ESD suppressors, on the input and output pins. Also, follow proper handling and storage procedures to prevent ESD damage.

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EGP20D Overview

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