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EL7155CSZ-T7 - Renesas Electronics

Description: The EL7155 high performance pin driver with 3-state is suited to many ATE and level-shifting applications. The 3. 5A peak drive capability makes this part an excellent choice when driving high capacitance loads. Output pins OUTH and OUTL are connected to input pins VH and VL respectively, depending on the status of the IN pin. One of the output pins is always in tri-state, except when the OE pin is low, in which case both outputs are in tri-state mode. The isolation of the output FETs from the power supplie

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EL7155CSZ-T7 - Renesas Electronics - PCB symbol
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PCB Footprints
EL7155CSZ-T7 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8. 15E
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3D Models
EL7155CSZ-T7 - Renesas Electronics - 3D model - Small Outline Packages - M8. 15E
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EL7155CSZ-T7 Details

  • Manufacturer Part Number:

    EL7155CSZ-T7

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15E

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2017-10-12

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

EL7155CSZ-T7 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and ensure that the PCB is designed with EMI-reducing features such as ground planes and shielding. Also, follow the recommended layout and routing guidelines.
  • Check the oscillator circuit for proper component values and layout. Ensure that the oscillator input pins are not loaded or shorted. Also, verify that the oscillator frequency is within the recommended range.
  • Operating the device at the maximum junction temperature can reduce its lifespan. Ensure that the device is operated within the recommended temperature range to ensure reliable operation and minimize the risk of thermal-related failures.

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EL7155CSZ-T7 Overview

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