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EL7566DREZ - Renesas Electronics

Description: The EL7566 is a full-feature synchronous step-down regulator capable of up to 6A and 96% efficiency. The device operates from 3V to 6V input supply (VIN). With internal CMOS power FETs, the device can operate at up to 100% duty ratio, allowing for an output voltage range of 0.8V to nearly VIN. An adjustable switching frequency up to 1MHz enables the use of small components, thereby reducing board area consumption to under 0.72sq-in on one side of a PCB. The EL7566 operates in constant frequency PWM mode, ma

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EL7566DREZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 28 Ld HTSSOP
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EL7566DREZ - Renesas Electronics  - 3D model - Small Outline Packages - 28 Ld HTSSOP
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EL7566DREZ Details

  • Manufacturer Part Number:

    EL7566DREZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP-EP

  • Package Description:

    TSSOP-EP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    MDP0048

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-18

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT/VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Output Current-Max:

    7.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

EL7566DREZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, component selection, and layout to minimize thermal resistance.
  • Use a combination of ceramic and electrolytic capacitors for decoupling. Place a 10uF ceramic capacitor close to the IC, and a 100uF electrolytic capacitor nearby. Ensure a low-ESR capacitor for the output filter.
  • Use a Type III compensation network with a series RLC circuit. Choose a 10uH inductor and a 10uF capacitor for the output filter. Adjust the component values based on the specific application requirements.
  • Use a shielded enclosure, and ensure proper PCB layout and component placement to minimize radiation. Implement a common-mode choke and a differential-mode filter to reduce EMI emissions.

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EL7566DREZ Overview

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