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ELANSC520-100AD - AMD

Description: MCU 32-bit RISC ROMLess 388-Pin BGA

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PCB Footprints
ELANSC520-100AD - AMD PCB footprint - BGA - BGA - 388-Pin Plastic BGA (PBGA)
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3D Models
ELANSC520-100AD - AMD  - 3D model - BGA - 388-Pin Plastic BGA (PBGA)
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ELANSC520-100AD Details

  • Manufacturer Part Number:

    ELANSC520-100AD

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    AMD

  • YTEOL:

    0

ELANSC520-100AD Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for ELANSC520-100AD is 0°C to 70°C (32°F to 158°F).
  • To ensure reliable operation in high-temperature environments, it is recommended to use a heat sink or thermal management system to keep the device temperature within the recommended operating range.
  • The maximum current rating for the ELANSC520-100AD is 1.5A per pin, with a total current rating of 3A for the entire device.
  • To minimize EMI, it is recommended to use a shielded enclosure, keep signal traces short, and use decoupling capacitors to filter out noise.
  • The recommended power-up sequence for ELANSC520-100AD is to apply power to the VCC pin first, followed by the VDD pin, and then the clock signal.

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ELANSC520-100AD Overview

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