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EM2130L02QI - Intel

Description: Intel® Enpirion® Power Solutions

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EM2130L02QI - Intel - PCB symbol
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PCB Footprints
EM2130L02QI - Intel PCB footprint - Other - Other - EM2130L02QI
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EM2130L02QI - Intel - 3D model - Other - EM2130L02QI
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EM2130L02QI Details

  • Manufacturer Part Number:

    EM2130L02QI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-104

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 0.7 TO 1.325V; ALSO REQUIRE INPUT VOLTAGE FROM 4.5V TO 16V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-XXSS-N104

  • Length:

    17 mm

  • Number of Functions:

    1

  • Number of Terminals:

    104

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SPECIAL SHAPE

  • Seated Height-Max:

    6.91 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    800 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    UNSPECIFIED

  • Width:

    11 mm

EM2130L02QI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Ensure the device is operated within the specified temperature range (-40°C to 105°C).
  • Power sequencing: VCCIO, then VCC, then VREF. Voltage ramp-up time: 10ms maximum. Ensure a monotonic voltage ramp-up to prevent latch-up or damage.
  • Implement ESD protection devices (e.g., TVS diodes) on all external interfaces. Ensure a robust latch-up prevention scheme, including diodes and resistors, to prevent internal damage.
  • Use 0.1uF to 1uF decoupling capacitors, placed as close as possible to the device's power pins. Ensure a low-ESR capacitor with a voltage rating exceeding the maximum operating voltage.

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EM2130L02QI Overview

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