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EM513GP-TP - MCC

Description: Standard Recovery Rectifiers

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Symbol
EM513GP-TP - MCC - PCB symbol
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PCB Footprints
EM513GP-TP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO-41
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3D Models
EM513GP-TP - MCC - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO-41
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EM513GP-TP Details

  • Manufacturer Part Number:

    EM513GP-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2017-01-06

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.99

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JEDEC-95 Code:

    DO-41

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    25 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1600 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

EM513GP-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the Micro Commercial Components' application note AN-113, which provides guidelines for optimal performance and thermal management.
  • Follow the recommended soldering profile and temperature guidelines in the datasheet, and ensure the device is properly aligned and secured during the reflow process. Additionally, use a solder paste with a high melting point to prevent damage.
  • The maximum operating temperature range for the EM513GP-TP is -40°C to 125°C. Performance may degrade at higher temperatures, with a maximum junction temperature of 150°C. Ensure proper thermal management and heat sinking to maintain optimal performance.
  • Follow proper ESD handling and assembly procedures, such as using ESD-safe materials, grounding straps, and wrist straps. Ensure the device is properly packaged and stored in ESD-safe containers to prevent damage.
  • Follow the test and measurement procedures outlined in the datasheet, and use industry-standard test equipment and software. Additionally, consult the Micro Commercial Components' application notes and technical support resources for guidance on specific test and measurement procedures.

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EM513GP-TP Overview

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For a full list of alternate parts for EM513GP-TP, check out Findchips.com