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EM78P156ELP - ELAN Microelectronics Corp

Description: * 18 pin DIP 300mil

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PCB Footprints
EM78P156ELP - ELAN Microelectronics Corp PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 18-Lead Plastic Dual in line (PDIP) — 300 mil
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3D Models
EM78P156ELP - ELAN Microelectronics Corp  - 3D model - Dual-In-Line Packages - 18-Lead Plastic Dual in line (PDIP) — 300 mil
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EM78P156ELP Details

  • Manufacturer Part Number:

    EM78P156ELP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Part Package Code:

    DIP

  • Package Description:

    DIP-18

  • Pin Count:

    18

  • HTS Code:

    8542.31.00.15

  • Manufacturer:

    ELAN Microelectronics Corp

  • Bit Size:

    8

  • JESD-30 Code:

    R-PDIP-T18

  • JESD-609 Code:

    e3

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP18,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    48

  • ROM (words):

    1024

  • ROM Programmability:

    UVPROM

  • Speed:

    20 MHz

  • Supply Current-Max:

    4 mA

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

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EM78P156ELP Overview

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