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EMC1704-2-AP-TR - Microchip

Description: Current & Power Monitors & Regulators USB Port Power Control w/ Emulation

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PCB Footprints
EMC1704-2-AP-TR - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-Pin QFN 4mm x 4mm
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3D Models
EMC1704-2-AP-TR - Microchip  - 3D model - Quad Flat No-Lead - 16-Pin QFN 4mm x 4mm
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EMC1704-2-AP-TR Details

  • Manufacturer Part Number:

    EMC1704-2-AP-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    4 X 4 MM, ROHS COMPLIANT, QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    24 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

EMC1704-2-AP-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the EMC1704-2-AP-TR near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can also help to dissipate heat efficiently.
  • To ensure accurate temperature measurements, it's essential to follow proper PCB layout guidelines, minimize thermal gradients, and calibrate the device according to the datasheet. Additionally, using a high-precision voltage reference and a low-noise power supply can help to improve measurement accuracy.
  • The recommended power-up sequence for the EMC1704-2-AP-TR involves applying the power supply voltage (VDD) before the input voltage (VIN). This ensures that the internal voltage regulator is fully powered up before the input voltage is applied.
  • The thermal shutdown feature of the EMC1704-2-AP-TR is designed to protect the device from overheating. When the device exceeds the thermal shutdown threshold, it will shut down until the temperature drops below the threshold. To handle this feature, ensure that your system design can tolerate temporary shutdowns and implement a suitable thermal management strategy.
  • The recommended method for soldering the EMC1704-2-AP-TR involves using a reflow soldering process with a peak temperature of 240°C (max) and a dwell time of 30-60 seconds. Ensure that the PCB is designed for reflow soldering and that the soldering process is performed in a controlled environment.

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EMC1704-2-AP-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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