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EMN11T2R - ROHM Semiconductor

Description: High-speed switching, 80V, 100mA, 2 Pair Cathode Common Switching Diode

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EMN11T2R - ROHM Semiconductor PCB footprint - Other - Other - EMN11T2R-3
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EMN11T2R - ROHM Semiconductor  - 3D model - Other - EMN11T2R-3
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EMN11T2R Details

  • Manufacturer Part Number:

    EMN11T2R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-107C, 6 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.1

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    2 BANKS, COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.15 W

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

EMN11T2R Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature, and ensure good airflow around the device.
  • While the datasheet specifies a maximum voltage rating of 12V, it's essential to note that the device can withstand voltage transients up to 15V for a short duration (less than 100ms). However, continuous operation above 12V is not recommended.
  • To protect the device from ESD damage, follow standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation. Ensure that all equipment and tools are properly grounded, and avoid touching the device's pins or exposed internal components.
  • ROHM recommends storing the device in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -20°C to 40°C, and the relative humidity should be below 60%. Avoid storing the device in environments with high levels of pollution or corrosive gases.

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EMN11T2R Overview

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